ASX

SK hynix signed an MOU with TSMC to co-develop HBM4 (targeted for mass production in 2026) and next-generation packaging to improve logic+HBM integration, focusing first on improving the HBM base die (logic die) performance using TSMC’s leading foundry process. This supports a longer-term thesis of tighter co-optimization between AI accelerators, advanced packaging, and HBM supply chains.

AGC announced participation in SEMICON SEA 2026 (May 5–7, 2026; Kuala Lumpur) where it will showcase semiconductor materials/components including glass substrates for advanced packaging, glass carriers, films, resin products, synthetic fused silica glass (AQ series), refrigerant gas (AMOLEA™ 1224 YD), and fluorochemical recycling initiatives focused on energy/emissions efficiency and circularity.

Speaker posts a portfolio update: 24 stocks, no options, 78% USA / 22% international. They state they are completely out of Korea/Japan and only have one Taiwan name left ($ASX). Rationale: the area (Korea/Japan/Taiwan themes like optics, memory, etc.) has heavy attention/crowding; they are taking a contrarian approach (“when the market zigs, I zag”).