AMKR

Single short post arguing $AMKR’s ~30% drawdown from ATH is unjustified given recent developments, highlighting a 10-year advanced packaging agreement with TSMC signed in June. Implies a bullish mean-reversion / fundamentals-improving setup after sector-wide selloff.

Social posts claim AMD’s next-gen MI500 GPU platform may incorporate optical interconnects and be ahead of Nvidia’s Rubin Ultra in HBM, 4-die packaging, and scale-up domain. Separately, analyst Jeff Pu raises AI accelerator TAM to ~$1.4T by 2030 (from $1T) and lifts 2028 forecast to ~$1T; server CPU TAM >$220B by 2030 with “agentic AI” ~50% of TAM and discussion of CPU:GPU mix. This is high-level/rumor + sell-side TAM framing (directionally bullish for AI compute supply chain, but low verifiabil

SK hynix signed an MOU with TSMC to co-develop HBM4 (targeted for mass production in 2026) and next-generation packaging to improve logic+HBM integration, focusing first on improving the HBM base die (logic die) performance using TSMC’s leading foundry process. This supports a longer-term thesis of tighter co-optimization between AI accelerators, advanced packaging, and HBM supply chains.

AGC announced participation in SEMICON SEA 2026 (May 5–7, 2026; Kuala Lumpur) where it will showcase semiconductor materials/components including glass substrates for advanced packaging, glass carriers, films, resin products, synthetic fused silica glass (AQ series), refrigerant gas (AMOLEA™ 1224 YD), and fluorochemical recycling initiatives focused on energy/emissions efficiency and circularity.